Semiconductor News 20251223

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1. Samsung’s HBM4 Clears Nvidia Tests, Signaling a Turnaround in the Memory Market
   Samsung Electronics’ next-generation memory, HBM4 SiP (System in Package), has reportedly outperformed the competition in Nvidia’s performance tests. The HBM market had been led by SK Hynix, but Samsung has gained confidence by overcoming technical challenges through a “redesign”. This achievement has raised the possibility of a reversal of market share as competition for the supply of memory for AI semiconductors intensifies.
2. TSMC to Convert Kumamoto Fab 2 to 2nm Process, Denies Delay Rumors
   It has been reported that TSMC’s Kumamoto Fab 2 (JASM) is going to raise its manufacturing technology from the originally planned 6nm process to the most advanced 2nm process at once. TSMC has also refuted rumors that the construction of the Japanese plant has been delayed, indicating that it will proceed as planned. If realized, this will dramatically increase the cutting-edge semiconductor manufacturing capacity in Japan and strengthen the supply base for AI and HPC.
3. Memory prices soaring and supply shortages getting worse, predicted to last until 2027
   The surge in demand from the AI boom is absorbing all memory supply, causing DRAM and NAND prices to soar Major manufacturers such as Micron and YMTC are raising prices and reporting good results, and Xiaomi’s new smartphones and PC The situation is inevitable to be passed on to prices. Industry insiders have indicated that the shortage conditions caused by this “memory super-cycle” will continue until 2027, and related materials, such as glass substrates, are expected to be tight.
4. Chinese AI Chip Firms on Offensive and Tighter U.S. Regulations, Biren and Moore Threads
   Chinese GPU maker Moore Threads has announced a new AI chip, Huashan, to compete with Nvidia, and Biren Technology has launched its IPO in Hong Kong. Chinese companies are developing advanced chips using multi-patterning technology and other technologies even under U.S. sanctions. In response, U.S. think tanks have warned of technological loopholes, and the U.S. government has introduced new investment restrictions on Chinese high-tech companies, deepening the conflict.
5. Qualcomm Strengthens Offensive by Achieving 90% Game Compatibility in PC Semiconductors
   Aiming to expand its share of the PC semiconductor market, Qualcomm announced that PCs equipped with its chips are now compatible with about 90% of popular games. The company is resolving compatibility issues, which had been a challenge, and together with its enhanced hybrid AI functionality and acquisition strategy, it is trying to make inroads into the PC market, which is a stronghold of Intel and AMD. This move is intended to accelerate the spread of Arm-based “AI PCs” with superior power consumption and performance.
6. Intel Outsources Manufacturing to Samsung, Partnering in Foundry Market and Competing for Talent
   Intel has reportedly placed an order to outsource the manufacturing of some of its chips to Samsung’s foundry division, as Intel seeks to regain its position as an IDM (vertically integrated device manufacturer), Intel is trying to regain its position as an IDM (vertically integrated device manufacturer), but it is also pursuing a pragmatic alliance with Samsung. On the other hand, Intel’s attempts to extract human resources from TSMC have attracted attention, and the game for manufacturing technology and human resources among major players is becoming more active.
7. India’s Semiconductor Ecosystem Rapidly Expanding; Rohm, Tata and Others Strengthen Partnerships
   The semiconductor industry in India is rapidly expanding. Japan’s Rohm has formed a partnership with Tata Electronics for manufacturing, and AOI Electronics is helping Indian company Kaynes expand its operations. Through the Indian government’s AI governance framework development and acquisitions and partnerships with global companies, India is consolidating its position as a new manufacturing hub in the global semiconductor supply chain.
8. TSMC Plans to Put Next-Generation Packaging “CoPoS” into Operation in Mid-2026
   TSMC plans to put its Co-Packaged Optics System (CoPoS) equipment, a next-generation packaging technology, into operation in mid-2026. This is part of an optoelectronic fusion technology that will dramatically improve the data transmission speed and power efficiency of AI chips and encourage Taiwanese companies to innovate through collaboration with overseas suppliers. The race for implementation technology to surpass the limits of Moore’s Law has entered a new phase.
9. ST Micro and SpaceX Celebrate 10 Years of Partnership in Support of Starlink
   STMicroelectronics and SpaceX celebrated the 10th anniversary of their collaboration on Starlink, a satellite communications network ST, through the supply of chips for ground stations and satellites, helping to ensure global connectivity. The close collaboration between the space and semiconductor industries is an important infrastructure foundation for the future of 6G communications and IoT connectivity.
10. Sony Semiconductor Solutions is looking to the future in humanoid robots and optoelectronic integration technology
    Sony Semiconductor Solutions is setting its sights on humanoid robots (humanoids) and optoelectronic integration technology as the next growth areas after smart phones. The company is applying its image sensor technology to strengthen development of sensing functions that will become the “eyes” of robots and optical communication technology that will contribute to power saving in data centers, and is drawing up a long-term strategy to develop these into new profit pillars in the 2030s.

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