TOC
Main News
- TSMC Expands 3nm/2nm and CoWoS Production Capacity 24 Hours a Day TSMC is expanding its state-of-the-art 3nm and 2nm process manufacturing capacity to meet the rapidly growing demand for AI chips. In addition, TSMC is operating its fabs around the clock to enhance production of CoWoS, an advanced packaging technology essential for NVIDIA’s products. This is a strategic initiative to eliminate AI-related supply bottlenecks in the foundry market.
- Nvidia Shifts Memory for AI Servers to LPDDR, Samsung to Benefit Most NVIDIA is reportedly stepping up its use of LPDDR (Low-Power Double Data Rate) memory, as well as HBM, in its AI server products. This move is aimed at improving the power efficiency and performance of AI chips, and Samsung, with its LPDDR supply capacity, is expected to stand to gain the most in the market.
- TSMC’s Capital Expenditures for 2026 Will Approach US$50 Billion for 2nm Expansion and Global Expansion TSMC’s capital expenditures (CapEx) for 2026 are expected to reach approximately US$50 billion. This massive investment will be primarily for 2nm process technology expansion and factory construction around the world (global expansion). This demonstrates TSMC’s strong commitment to maintaining its leadership in advanced process technology.
- Samsung Converts NAND Lines to DRAM to Meet Surging AI Memory Demand Due to surging demand for AI memory, especially high bandwidth memory (HBM), Samsung is reportedly changing its production strategy and converting some of its NAND flash production lines to DRAM production. This strategic reallocation is expected to lead to a significant increase in supply and demand for DRAM. This strategic reallocation is intended to increase supply capacity in the advanced AI memory market, where supply is tight.
- Japan to Become Rapidus’ Largest Shareholder: 100 Billion Yen Investment and IPO in 2031 The Japanese government is expected to invest 100 billion yen in Rapidus, which aims to domestically produce next-generation semiconductors, making it the largest shareholder, With strong government support, Rapidus plans to become profitable in FY2030 and to IPO in FY2031, accelerating the national effort to revive Japan’s semiconductor industry.
- Intel’s EMIB Emerges as Potential Alternative to TSMC’s CoWoS Intel’s advanced packaging technology, Embedded Multi-Die Interconnect Bridge (EMIB), is gaining attention as a potential alternative to TSMC’s leading CoWoS technology. EMIB is currently being increasingly adopted by customers for AI ASICs and smartphones and may be used for TSMC die (chip) packaging in the future.
- Dependence on Chinese Chips Al most Freezes Global Automotive Production Warns of Serious Risk of Overreliance on Specific Sources, Especially Chinese Chips, Almost Freezing Global Automotive Production Through the Nexperia case, a warning has been issued that overreliance on specific sources, especially Chinese chips, poses a serious risk of almost freezing global automotive production. This situation strongly illustrates the geopolitical risks and vulnerability of reliance on a single source of supply in global supply chains.
- Amazon Plans to Invest up to 7.8 Trillion in AI Cloud Offerings for the U.S. Government Amazon has signed a contract to provide advanced AI cloud services for the U.S. government and plans to invest up to 7.8 trillion yen in connection with the deal. This significant investment will help government agencies enhance their digital transformation and AI infrastructure, illustrating the scale of AI technology’s penetration into the public sector.
- Micron Denies HBM4 Redesign, Confirms 2026 Launch and Fully Booked Micron has denied rumors about a redesign of its next-generation high-bandwidth memory, HBM4. The company confirmed that HBM4 will launch in 2026 as planned and further revealed that its production capacity is already fully booked. This highlights the very high level of demand for advanced memory in the AI accelerator market.
- Intel “Nova Lake” NPU 6 Delivers 74 TOPS for Desktop AI PCsNPU 6 in Intel’s next-generation “Nova Lake” desktop chips delivers 74 TOPS (Tera Operations Per Second) of AI processing power This performance is the first time an AI PC has achieved this level of performance in the evolution of AI PCs. This performance is a key metric driving the evolution of AI PCs, enabling faster local AI applications in desktop environments.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Nov 24, 10:55 | TSMC、24時間生産強化の中で3/2nmおよびCoWoSの生産能力を拡大 | TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push | https://www.digitimes.com/news/a20251124PD209/tsmc-capacity-cowos-nvidia-production.html |
| Nov 24, 13:45 | Nvidia、AIサーバ向けにLPDDRへシフト、Samsungが最大の恩恵を受ける | Nvidia shifts to LPDDR for AI servers, Samsung poised to benefit most | https://www.digitimes.com/news/a20251124PD231/nvidia-samsung-ddr-hbm-demand.html |
| Nov 24, 11:23 | Micron、HBM4の再設計を否定し、2026年の発売と予約完了を確認 | Micron denies redesign of HBM4, confirms 2026 launch with full bookings | https://www.digitimes.com/news/a20251124PD213/micron-hbm4-design-nvidia-2026.html |
| Nov 24, 10:52 | 独占：Lenovo、Samsungとの提携と中国供給優先でDRAM不足の影響を回避 | Exclusive: Lenovo stays insulated from DRAM crunch with Samsung ties, China supply priority | https://www.digitimes.com/news/a20251124PD212/dram-lenovo-samsung-pc-supply-chain.html |
| Nov 24, 09:42 | IntelのEMIB、TSMCのCoWoSに対する潜在的な代替手段に | Intel’s EMIB becomes potential alternative to TSMC’s CoWoS | https://www.digitimes.com/news/a20251124PD211/tsmc-intel-cowos-packaging-capacity.html |
| Nov 24, 16:46 | 韓国、米国チップ関税に対し台湾との共同戦略を模索 | South Korea seeks joint strategy with Taiwan on US chip tariffs | https://www.digitimes.com/news/a20251124VL208/taiwan.html |
| Nov 24, 16:41 | DDR5のブレークスルー：CXMTがIC China 2025で8000Mbpsメモリを披露 | DDR5 breakthrough: CXMT showcases 8000Mbps memory at IC China 2025 | https://www.digitimes.com/news/a20251124VL205/cxmt-dram-ddr5-ic-2025.html |
| Nov 24, 16:02 | 報道によると、Samsungは急増するAIメモリ需要に対応するためNANDラインをDRAMに転換 | Samsung reportedly converts NAND lines to DRAM to meet surging AI memory demand | https://www.digitimes.com/news/a20251124PD215/samsung-nand-dram-demand-production.html |
| Nov 24, 16:00 | 台湾、半導体パークの専門知識を輸出する中、米国はチップ関税を撤廃 | US to waive chip tariffs as Taiwan exports semiconductor park expertise | https://www.digitimes.com/news/a20251124PD238/taiwan-industrial-nstc-semiconductor-industry-taipei.html |
| Nov 24, 15:43 | Wingtech、オランダ政府に訴える中でNexperia紛争が続く | Nexperia dispute continues as Wingtech appeals to Dutch government | https://www.digitimes.com/news/a20251124PD234/nexperia-netherlands-government-takeover-china.html |
| Nov 24, 15:06 | Nvidiaのモバイルメモリ進出が供給と価格の懸念を呼ぶ | Nvidia’s move into mobile memory sparks supply and price concerns | https://www.digitimes.com/news/a20251121PD234/nvidia-mobile-market-demand-2026.html |
| Nov 24, 13:42 | 日本、Rapidusの筆頭株主に：1000億円の投資で | Japan to become majority stakeholder in Rapidus with JPY100 billion investment | https://www.digitimes.com/news/a20251124PD229/rapidus-government-investment-funding-bloomberg.html |
| Nov 24, 12:40 | 報道によると、SK Hynixはインドのパートナーを模索中だが、公式な計画は未発表 | SK Hynix reportedly exploring Indian partner, but no official plans announced | https://www.digitimes.com/news/a20251124VL207/sk-hynix-dram-production-investment-capacity-expansion.html |
| Nov 24, 12:30 | Toshibaの中国におけるSiC転換が日本のパワーチップ介入を引き起こす | Toshiba’s China SiC turn triggers Japan’s power-chip intervention | https://www.digitimes.com/news/a20251124PD228/toshiba-sic-rohm-partnership-denso.html |
| Nov 24, 11:49 | メモリスーパーサイクル熱狂がSamsungとSK Hynixの2025年納税を牽引と予想 | Memory supercycle frenzy expected to drive Samsung and SK Hynix 2025 tax payments | https://www.digitimes.com/news/a20251124PD225/sk-hynix-samsung-2025-chipmakers-hbm.html |
| Nov 24, 11:48 | Lightmatterのシリコンフォトニクスソリューション、2027年の商業出荷を目指す | Lightmatter’s silicon photonics solution aims for commercial shipments in 2027 | https://www.digitimes.com/news/a20251121PD230/silicon-photonics-globalfoundries-shipments-commercial.html |
| 日経 Tech Foresight | |||
| 2025-11-25 | 「IBMが新型量子チップ」「自己改善するAI」 海外動向 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC201730Q5A121C2000000 | |
| マイナビニュース テックプラス | |||
| TrendForce | |||
| 2025-11-24 | ネクスペリアの警告：中国製チップへの依存が世界の自動車生産をほぼ凍結寸前に追い込む | The Nexperia Wake-Up Call: Reliance on Chinese Chips Nearly Froze Global Auto Production | https://www.trendforce.com/news/2025/11/24/news-the-nexperia-wake-up-call-reliance-on-chinese-chips-nearly-froze-global-auto-production/ |
| 2025-11-24 | 日本は2030年度の黒字化と2031年度のIPOを目指し、ラピダス支援に1兆円を追加する模様 | Japan Reportedly Adding ¥1 Trillion in Rapidus Support as It Targets FY2030 Profitability, FY2031 IPO | https://www.trendforce.com/news/2025/11/24/news-japan-reportedly-adding-%c2%a51-trillion-in-rapidus-support-as-it-targets-fy2030-profitability-fy2031-ipo/ |
| 2025-11-24 | キオクシアの決算後の課題：QLC移行の遅れとSKハイニックスによる非系列の株式保有 | Kioxia’s Post-Earnings Challenges: QLC Transition Lag, SK hynix’s Arms-Length Stake | https://www.trendforce.com/news/2025/11/24/news-kioxias-post-earnings-challenges-qlc-transition-lag-sk-hynixs-arms-length-stake/ |
| 2025-11-24 | TSMCの2026年設備投資は、2nm拡大とグローバル展開によって約500億米ドルに迫る模様 | TSMC’s 2026 CapEx Reportedly Near US$50B, Driven by 2nm Expansion and Global Buildout | https://www.trendforce.com/news/2025/11/24/news-tsmcs-2026-capex-reportedly-near-us50b-driven-by-2nm-expansion-and-global-buildout/ |
| 2025-11-24 | インテルのEMIBは、AI用ASICおよびスマートフォン向け顧客で利用が拡大し、TSMC製ダイのパッケージングも可能性が浮上 | Intel’s EMIB Reportedly Gains Traction with AI ASIC, Smartphone Clients, Could Package TSMC Dies | https://www.trendforce.com/news/2025/11/24/news-intels-emib-reportedly-gains-traction-with-ai-asic-smartphone-clients-could-package-tsmc-dies/ |
| Semiconductor Digest | |||
| 2 hours ago | RPIとGlobalFoundries、半導体研究、教育、人材育成に関するイニシアティブで提携 | RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives | https://www.semiconductor-digest.com/rpi-and-globalfoundries-partner-on-semiconductor-research-education-and-workforce-development-initiatives/ |
| 2 hours ago | Kneron、KL1140チップを発売 | Kneron Launches KL1140 Chip | https://www.semiconductor-digest.com/kneron-launches-kl1140-chip/ |
| 8 hours ago | 半導体ウェーハ製造におけるサーマルループの最適化 | Optimizing the Thermal Loop for Semiconductor Wafer Manufacturing | https://www.semiconductor-digest.com/optimizing-the-thermal-loop-for-semiconductor-wafer-manufacturing/ |
| 8 hours ago | ALDにおける原子レベルの清浄性 | Atomic-Level Cleanliness in ALD | https://www.semiconductor-digest.com/atomic-level-cleanliness-in-ald/ |
| 8 hours ago | アメリカにおける活気ある化学半導体サプライチェーンの構築 | Creating a Thriving Chemical Semiconductor Supply Chain in America | https://www.semiconductor-digest.com/creating-a-thriving-chemical-semiconductor-supply-chain-in-america/ |
| 日本経済新聞 | |||
| 2025-11-25 | NY株ハイライト 12月米利下げ予想8割まで回復 相場に下げ止まり機運 | https://www.nikkei.com/article/DGXZQOFL2435Y0U5A121C2000000/ | |
| 2025-11-25 | 米国株、ダウ続伸し202ドル高 利下げ観測でハイテク買い ナスダック2.6%高 | https://www.nikkei.com/article/DGXZQOFL243MH0U5A121C2000000/ | |
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| 2025-11-25 | NYダウ、続伸し202ドル高 利下げ観測でハイテク買い | https://www.nikkei.com/article/DGXZQOFL2500U0V21C25A1000000/ | |
| 2025-11-25 | 米国株15時、ダウ続伸 一時300ドル高 利下げ観測が支え | https://www.nikkei.com/article/DGXZQOFL2435S0U5A121C2000000/ | |
| 2025-11-25 | ホンダの下期世界販売、半導体不足で日本車2位→4位に 3強崩れる | https://www.nikkei.com/article/DGXZQOUC134MO0T11C25A1000000/ | |
| 2025-11-25 | 利益増えた企業、日立やアドバンテストが4〜9月上位 AIの恩恵浸透 | https://www.nikkei.com/article/DGXZQOUB185HD0Y5A111C2000000/ | |
| 2025-11-25 | ドイツ株24日 反発、独バイエル急伸 防衛関連は下落 | https://www.nikkei.com/article/DGXZQOFL243820U5A121C2000000/ | |
| 2025-11-25 | 地方への投資促進、熊本モデルの産業集積を柱に 年内に戦略策定 | https://www.nikkei.com/article/DGXZQOUA206PD0Q5A121C2000000/ | |
| 2025-11-25 | 車の1000万台クラブ 2040年、中国車は世界を覆うか | https://www.nikkei.com/article/DGXZQOCD200L60Q5A121C2000000/ | |
| ダイヤモンドオンライン | |||
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| Tom’s Hardware | |||
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| TechPowerup | |||
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| EETimes Taiwan | |||
| 2025-11-24 | マイクログリッドと予備電源：エネルギーのレジリエンスを実現する完璧な組み合わせ | 微電網和備用電源：能源韌性的完美結合 | https://www.eettaiwan.com/20251124nt61-microgrids-and-backup-power-a-perfect-match-for-energy-resilience/ |
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| EETimes Asia | |||
| 2025-11-24 | VSORAとGUCがJotunn8データセンター向けAI推論プロセッサで提携 | VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor | https://www.eetasia.com/vsora-and-guc-partner-on-jotunn8-datacenter-ai-inference-processor/ |
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| 2025-11-24 | STの18nm MCUが高性能産業用途をターゲットに | ST’s 18nm MCU Targeted at High-performance Industrial Applications | https://www.eetasia.com/sts-18nm-mcu-targeted-at-high-performance-industrial-applications/ |
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| EETimes India | |||
| 2025-11-24 | インド、ECMS下で17件の新規プロジェクト承認によりエレクトロニクス製造推進を拡大 | India Expands Electronics Manufacturing Push with Approval of 17 New Projects Under ECMS | https://www.eetindia.co.in/india-expands-electronics-manufacturing-push-with-approval-of-17-new-projects-under-ecms/ |
| 2025-11-24 | Chipus、12nmデータセンターASIC向けにQuickLogicのeFPGAハードIPを採用 | Chipus Taps QuickLogic eFPGA Hard IP for 12nm Datacenter ASIC | https://www.eetindia.co.in/chipus-taps-quicklogic-efpga-hard-ip-for-12nm-datacenter-asic/ |
| 2025-11-24 | IMEC、GaNのブレークダウン電圧650V超を実現 | IMEC Achieves GaN Breakdown Voltage Exceeding 650V | https://www.eetindia.co.in/imec-achieves-gan-breakdown-voltage-exceeding-650v/ |
| 2025-11-24 | IntelPro、CevaのIPライセンス取得でAIoT Matter対応チップを展開 | IntelPro Licenses Ceva IPs to Launch AIoT Matter-ready Chips | https://www.eetindia.co.in/intelpro-licenses-ceva-ips-to-launch-aiot-matter-ready-chips/ |
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| ZDNET Korea | |||
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| 中央日報 | |||
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