Semiconductor News 20250911

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1. TSMC Posts 33.8% Sales Growth in August – AI Demand and Profit Margin Pressure Affect Outlook TSMC recorded a 33.8% year-over-year sales increase in August, with AI demand driving growth. However, the company is also seeing pressure on profit margins, which could impact its outlook. This is an important indicator of growth and competition in the semiconductor market, and it will be interesting to see how TSMC maintains profitability as the AI boom continues.
2. TSMC Converts Existing Fabs to EUV Pellicle Powerhouse – Signaling a New Phase in Chip Manufacturing It has been reported that TSMC is converting its existing manufacturing plants to EUV (Extreme Ultraviolet) pellicle production facilities. This strategy aims to reduce manufacturing costs and improve efficiency by bringing the supply chain for EUV technology, which is essential for next-generation chip manufacturing, in-house. This is considered an important move that will strengthen TSMC’s leading role in the evolution of semiconductor manufacturing technology.
3. TSMC ‘s presence in Kumamoto exceeds expectations – over 200 new investment projects in Kyushu The construction of TSMC’s Kumamoto Plant (JASM) has reportedly triggered over 200 new investment projects in the Kyushu region, with economic ripple effects exceeding initial expectations This is a significant milestone for JASM, which is establishing a state-of-the-art semiconductor manufacturing base. This is a noteworthy example of how the establishment of a state-of-the-art semiconductor manufacturing base can greatly contribute to the concentration of related industries and the revitalization of the local economy.
4. SEMICON Taiwan 2025: Memory Giants Compete in Customized HBM Race Amid AI Surge At SEMICON Taiwan 2025, the development of customized High Bandwidth Memory (HBM) by leading memory manufacturers to meet the surging demand for AI The event showed that major memory manufacturers are accelerating the race to develop customized HBM (High Bandwidth Memory) to meet the surging demand for AI. The evolution of HBM, which is indispensable for high-performance AI chips, is said to hold the key to the future development of AI technology, and the technological innovations of various companies will be the focus of attention.
5. Samsung Seeks xAI Chip Alliance Following Major Deal with Tesla Samsung is reportedly considering a chip alliance with AI startup xAI following a major deal with Tesla. The partnership is part of Samsung’s strategy to strengthen its presence in the AI semiconductor market, with particular focus on cooperation in the development of chips for self-driving and next-generation AI. it is an important move toward establishing a major collaboration in the AI field.
6. NVIDIA New Module with 7.5x Performance for Humanoid Robots and Generative AI NVIDIA has announced an innovative new module for humanoid robots and generative AI that delivers 7.5x the performance of existing products. This high-performance module is expected to significantly accelerate applications in areas where complex AI processing is required. This is an important innovation that has the potential to contribute to breakthroughs in robotics and AI technology.
7. Intel Reaffirms Glass Substrate Roadmap – Pilot Line R umored for 2025 Intel has reaffirmed its roadmap for glass substrates, a promising next-generation semiconductor packaging technology, and a pilot line is rumored to be in operation in 2025. This is an important technological development for improving power efficiency and integration, which are key issues for high-performance chips, and is a move that could drive future innovation in the semiconductor industry.
8. Google Leads Cloud AI Competition with Advanced TPU Chips According to industry insiders, Google is reportedly establishing its leadership in the cloud AI market competition with its self-developed advanced Tensor Processing Unit (TPU) chips. TPUs are specialized for AI workloads and help Google’s AI services and cloud infrastructure become more competitive, accelerating the development of AI technology.
9. South Korea to Double SiC Self-Supply Rate to 20% by 2030 in Push for Chip Independence The South Korean government has announced plans to double the current domestic self-supply rate of silicon carbide (SiC) semiconductors to 20% by 2030 in a bid to achieve semiconductor supply chain independence. SiC is an essential material for electric vehicles and power electronics, and this initiative is expected to contribute to the stabilization of the global semiconductor supply chain.
10. Cadence’s Expanded Digital Twin Platform Library Accelerates AI Data Center Deployment and Operations Cadence has expanded its Digital Twin Platform library to accelerate AI data center deployment and operations. This technology is a key solution that enables data center design, simulation, and optimization to efficiently handle AI workloads and solve infrastructure management challenges, marking progress in AI infrastructure development.

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